Inventor · Rennes, FR

Jeffrey Ewanchuk

26Patents
1h-index
22Co-inventors
49Inventor score

Filing activity: Feb 12, 2015 → May 23, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US10985088B2 System comprising at least one power module comprising at least one power die that is cooled by liquid cooled system Electricity 5 Active
US11114349B2 System and method for allowing restoration of first interconnection of die of power module Electricity 1 Active
US11152340B2 Power module having a multilayered structure with liquid cooled busbar and method for manufacturing same Electricity 1 Active
US11251151B2 System and method for allowing restoration of interconnection of die of power module Electricity 1 Active
US10277218B2 System comprising multi-die power module, method for controlling operation of multi-die power module, device for controlling operation of multi-die power module Electricity 1 Active
US10886871B2 Method for controlling health of multi-die power module and multi-die health monitoring device Physics 1 Active
US11388845B2 Multi-die temperature control device and method for controlling temperature of multi-die power module Electricity 0 Active
US11448557B2 Method and device for determining junction temperature of die of semiconductor power module Physics 0 Active
US10367497B2 System comprising multi-die power and method for controlling operation of multi-die power module Electricity 0 Active
US9515012B2 Package of power dies and three-phase power converter Electricity 0 Active
US12176687B2 Power converter Electricity 0 Active
US10732617B2 Method, device and system for estimating level of damage of electric device using histograms Physics 0 Active
US10707744B2 Device and method for controlling operation of power module composed of switches Electricity 0 Active
US12063763B2 Cooling in conductors for chips Electricity 0 Active
US11217571B2 Power module and method for manufacturing power module Electricity 0 Active
US11955539B2 Device and method for manufacturing device Electricity 0 Active
US12095368B2 Compact circuit devices using ceramic-copper layers based packaging Electricity 0 Active
US11378612B2 Device and method for monitoring the health of a power semiconductor die Physics 0 Active
US11415625B2 Device and method for monitoring multi-die power module Physics 0 Active
US10084440B2 System comprising a multi-die power module, and method for controlling the switching of a multi-die power module Electricity 0 Active
US11532993B1 AC-to-AC power supplies using multi-frequency power conversion building blocks Emerging Cross-Sectional Technologies 0 Active
US11630154B2 Method and device for monitoring connection of semiconductor of power module Physics 0 Active
US10333385B2 Method and device for controlling the operation of multi-die power module Electricity 0 Active
US11935807B2 Plurality of dies electrically connected to a printed circuit board by a clip Electricity 0 Active
US10848052B2 Device and method for controlling temperature of multi-die power module Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.