Heat exchanger assemblies for electronic devices
US11255608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Feb 28, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2210/02
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat exchanger assemblies for electronic devices are disclosed. A heat exchanger assembly may include a heat transfer body that has a face that forms open passageways. A cover structure may be attached to the heat transfer body in a manner to enclose the open passageways, thereby forming a heat exchanger assembly that includes enclosed fluid conduits. In this regard, the enclosed fluid conduits may form complex and intricate patterns within the heat exchanger assembly that are tailored to the heat requirements of a particular application. Heat exchanger assemblies as described herein may be thermally coupled to a center waveguide section of a spatial power-combining device. The enclosed fluid conduits may be tailored based on locations of amplifiers within the center waveguide section to provide improved thermal operation of the spatial power-combining device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.