Apparatus and methods for chemical mechanical polishing
US11260495B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2018 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Jul 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for CMP is provided. The polishing pad includes a layer of material having a surface, a plurality of grooves indented into the surface in the layer of material, and a fluorescent indicator in the layer of material. Each of the plurality of grooves has a first depth, the fluorescent indicator has a second depth, and the second depth is equal to or less than the first depth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.