Aluminum plating at low temperature with high efficiency
US11261533B2 · kind B2 · utility
0Cited by
8References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 30, 2018 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure generally relates to methods of electro-depositing a crystalline layer of pure aluminum onto the surface of an aluminum alloy article. The methods may include positioning the article and an electrode in an electro-deposition solution. The electro-deposition solution includes one or more of an aluminum halide, an organic chloride salt, an aluminum reducing agent, a solvent such as a nitrile compound, and an alkali metal halide. The solution is blanketed with an inert gas, agitated, and a crystalline layer of aluminum is deposited on the article by applying a bias voltage to the article and the electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.