Wafer probe station

US11262401B2 · kind B2 · utility

Assignee

• MPI CORPORATION · TW

Inventors

• Stojan Kanev · Sacka, DE
• Chia-Hung Hung · Hsinchu, TW

Key dates

• Filing date: Apr 22, 2020
• Grant date: Mar 1, 2022
• Expiry date: May 4, 2040

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2875
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A wafer probe station includes a thermal chuck, a chuck stage, a platen, some probes, a first focusing device, a second focusing device and a thermal plate. The thermal chuck heats up to an operational temperature and holds a device under test (DUT). The chuck stage connects with the thermal chuck and moves the thermal chuck. The thermal chuck locates between the chuck stage and the platen. The probes are disposed on the platen and configured to contact with the DUT. The first focusing device is disposed on the platen to focus on the DUT. The second focusing device is disposed on the chuck stage to focus on the probes. The thermal plate locates between the second focusing device and the platen and is configured to heat up to the operational temperature. The thermal plate has a through hole aligning with the second focusing device.