Leakage-proof polishing pad and process for preparing the same
US11267098B2 · kind B2 · utility
0Cited by
5References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2018 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Jul 7, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments relate to a leakage-proof polishing pad for use in a chemical mechanical planarization (CMP) process and a process for producing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.