Jaein Ahn
11Patents
2h-index
10Co-inventors
40Inventor score
Filing activity: May 25, 2018 → Aug 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10513007B2 | Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same | Electricity | 2 | Active |
| US10518383B2 | Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same | Electricity | 2 | Active |
| US11534888B2 | Polishing pad with improved fluidity of slurry and process for preparing same | Performing Operations; Transporting | 1 | Active |
| US11964360B2 | Polishing pad comprising window similar in hardness to polishing layer | Electricity | 0 | Active |
| US11628535B2 | Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing pad | Chemistry; Metallurgy | 0 | Active |
| US11772236B2 | Porous polishing pad and process for producing the same all fees | Electricity | 0 | Active |
| US11571783B2 | Polishing pad having excellent airtightness | Electricity | 0 | Active |
| US12362232B2 | Polishing pad and method for preparing semiconductor device using the same | Electricity | 0 | Active |
| US11766759B2 | Porous polyurethane polishing pad and process for producing the same | Electricity | 0 | Active |
| US11000935B2 | Polishing pad that minimizes occurrence of defects and process for preparing the same | Electricity | 0 | Active |
| US11267098B2 | Leakage-proof polishing pad and process for preparing the same | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.