System and method for monitoring semiconductor manufacturing equipment via analysis unit
US11269003B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2020 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | May 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure provides a system and a method for monitoring semiconductor manufacturing equipment. The system includes a sensor, a circuit, and an analysis unit. The sensor provides a sensor signal. The circuit receives the sensor signal and generates an input signal. The analysis unit includes a signal management platform, receiving the input signal and performing a first data process to generate a first data signal; a diagnosis subsystem, receiving the first data signal from the signal management platform and performing a health status monitoring process to generate a second data signal; and a decision subsystem, performing a determination process to generate a third data signal according to the second data signal from the diagnosis subsystem. The diagnosis subsystem generates a feedback signal according to the third data signal, and the signal management platform transmits the feedback signal to the semiconductor manufacturing equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.