Substrate processing apparatus and substrate processing method
US11270873B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
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Key dates
| Filing date | Jul 14, 2020 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Jul 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing apparatus that processes a substrate using particles, includes a conveyance mechanism configured to convey the substrate along a conveyance surface, a particle source configured to emit particles, a rotation mechanism configured to make the particle source pivot about a rotation axis, and a movement mechanism configured to move the particle source such that a distance between the particle source and the conveyance surface is changed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.