Substrate processing apparatus
US11270904B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2017 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Jun 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus including a frame, a first SCARA arm having an end effector and being configured to extend and retract along a first axis, a second SCARA arm having an end effector and being configured to extend and retract along a second axis, a drive section including a splitting drive pulley rotatably mounted to rotate at an axis of rotation of the drive section that is shared by the first and second SCARA arms, the splitting drive pulley being coupled to at least two idler pulleys by respective segmented transmission loops of separate band segments so that the splitting drive pulley is a common pulley splitting one degree of freedom of the drive section between the at least two idler pulleys so as to commonly drive the at least two idler pulleys, wherein at least one band of each respective transmission loop share a common band interface level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.