Integrated inductor with magnetic mold compound
US11270937B2 · kind B2 · utility
1Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2018 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Jan 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19102
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package comprises a semiconductor die, a leadframe comprising a plurality of leads coupled to bond pads on the semiconductor die, and an electrically conductive member electrically coupled to the leadframe. A magnetic mold compound encapsulates the electrically conductive member to form an inductor. A non-magnetic mold compound encapsulates the semiconductor die, the leadframe, and the magnetic mold compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.