Inventor · Carrollton, TX, US

Steven Kummerl

43Patents
7h-index
51Co-inventors
68Inventor score

Filing activity: Aug 12, 2004 → Apr 12, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7578422B2 Bond capillary design for ribbon wire bonding Electricity 111 Active
US7216794B2 Bond capillary design for ribbon wire bonding Electricity 49 Expired
US8569082B2 Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame Electricity 17 Active
US7741704B2 Leadframe and mold compound interlock in packaged semiconductor device Electricity 11 Active
US7847391B2 Manufacturing method for integrating a shunt resistor into a semiconductor package Electricity 9 Active
US7821113B2 Leadframe having delamination resistant die pad Electricity 8 Active
US7635613B2 Semiconductor device having firmly secured heat spreader Electricity 7 Expired
US8129228B2 Manufacturing method for integrating a shunt resistor into a semiconductor package Electricity 5 Active
US7256482B2 Integrated circuit chip packaging assembly Electricity 5 Expired
US9378882B2 Method of fabricating an electronic circuit Electricity 4 Active
US10861796B2 Floating die package Electricity 3 Active
US9646906B2 Semiconductor package with printed sensor Electricity 3 Active
US8053876B2 Multi lead frame power package Electricity 2 Active
US7919842B2 Structure and method for sealing cavity of micro-electro-mechanical device Electricity 2 Active
US8072770B2 Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame Electricity 2 Active
US9496171B2 Printed interconnects for semiconductor packages Electricity 2 Active
US12176298B2 Floating die package Electricity 1 Active
US11270937B2 Integrated inductor with magnetic mold compound Electricity 1 Active
US7504713B2 Plastic semiconductor packages having improved metal land-locking features Electricity 1 Active
US11972994B2 Film covers for sensor packages Electricity 0 Active
US9679864B2 Printed interconnects for semiconductor packages Electricity 0 Active
US7488623B2 Integrated circuit chip packaging assembly Electricity 0 Active
US10804185B2 Integrated circuit chip with a vertical connector Electricity 0 Active
US12211800B2 Semiconductor package with shunt and patterned metal trace Electricity 0 Active
US12040197B2 Mechanical couplings designed to resolve process constraints Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.