Patent · US Active

Package with electrical interconnection bridge

US11270946B2 · kind B2 · utility

0Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 6, 2020
Grant dateMar 8, 2022
Priority date—
Expiry dateSep 2, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/10158
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.