Patent · US Active

Embedded copper structure for microelectronics package

US11270974B2 · kind B2 · utility

0Cited by

13References

19Claims

0Family size

Assignee

Flex Ltd. · SG

Inventors

Cheng Yang · Shanghai, CN
Dongkai Shangguan · Novi, US
Li Yao · Pudong New District, CN

Key dates

Filing date	Dec 10, 2019
Grant date	Mar 8, 2022
Priority date	—
Expiry date	Dec 24, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1131
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component and a method of manufacturing an electronic component, the method including surface mounting electronic components to a printed circuit board (PCB), applying a flip-chip die integrated circuit (IC) to the PCB and underfilling the flip-chip IC to secure the PCB. The method also includes sintering a copper block to the PCB, where the copper block is in thermal communication with the IC and acts as a thermal path for removing heat generated by the flip-chip IC.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.