Package with overhang inductor
US11270986B2 · kind B2 · utility
0Cited by
11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2020 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Aug 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M3/1582
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.