Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits
US11272618B2 · kind B2 · utility
2Cited by
151References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2017 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Apr 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.