One-component toughened epoxy adhesives containing a mixture of latent curing agents
US11274236B2 · kind B2 · utility
1Cited by
16References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2018 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Jun 30, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2203/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A one-component toughened epoxy-modified polyurethane and/or urea adhesive includes a mixture of dicyandiamide and a dihdyrazide as curing agents. The mixture of curing agents permits the adhesive to be cured at lower temperatures while developing good adhesive and mechanical properties in the cured adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.