Conformal multi-plane material deposition
US11276641B1 · kind B1 · utility
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11Claims
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Key dates
| Filing date | Jan 6, 2020 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Mar 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device fabrication system may include, but is not limited to: a conductive material deposition device configured for deposition of a conductive material; at least one electronic device substrate configured to receive deposited conductive material; and at least one mask configured to selectively transmit the conductive material to the electronic device substrate, wherein the at least one mask configured to selectively transmit the conductive material to the electronic device substrate includes: at least a first side disposed at an angle relative to an adjacent second side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.