Semiconductor device package and method for manufacturing the same
US11276806B2 · kind B2 · utility
1Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2020 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Feb 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.