Polishing slurry composition
US11279851B2 · kind B2 · utility
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1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2019 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | May 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a polishing slurry composition including colloidal silica abrasive particles, a metal oxide monomolecular complexing agent, an oxidizer, and a pH adjusting agent, a water-soluble polymer, or both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.