Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

US11282717B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Ziyin Lin · Chandler, US
• Vipul V. Mehta · Chandler, US
• Edvin Cetegen · Chandler, US
• Yuying Wei · Chandler, US
• Sushrutha Gujjula · Chandler, US
• Nisha Ananthakrishnan · Chandler, US
• Shan Zhong · Clarksville, US

Key dates

• Filing date: Mar 30, 2018
• Grant date: Mar 22, 2022
• Expiry date: Jul 3, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/09045
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. The substrate protrusion can enable void-free underfill.