Yuying Wei
4Patents
1h-index
13Co-inventors
41Inventor score
Filing activity: Dec 20, 2012 → Feb 10, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11282717B2 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Electricity | 1 | Active |
| US9330993B2 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Electricity | 1 | Active |
| US11776821B2 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Electricity | 0 | Active |
| US10115606B2 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.