Control device of substrate processing apparatus and control method of substrate processing apparatus
US11282727B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 21, 2019 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Jun 3, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45031
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A control device of a substrate processing apparatus includes a reading unit, an estimation unit, a comparison unit, and a correction unit. The reading unit reads out a reference processing condition for processing a substrate. The estimation unit estimates an actual processing condition when the substrate is processed. The comparison unit compares the reference processing condition and the actual processing condition with each other. The correction unit corrects a processing condition for the substrate based on a comparison result in the comparison unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.