Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
US11286346B2 · kind B2 · utility
1Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2016 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jan 13, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/03
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.