3D MEMS magnetometer and associated methods
US11287486B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 2, 2015 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Mar 3, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micro-electro-mechanical system (MEMS) magnetometer is provided for measuring magnetic field components along three orthogonal axes. The MEMS magnetometer includes a top cap wafer, a bottom cap wafer and a MEMS wafer having opposed top and bottom sides bonded respectively to the top and bottom cap wafers. The MEMS wafer includes a frame structure and current-carrying first, second and third magnetic field transducers. The top cap, bottom cap and MEMS wafer are electrically conductive and stacked along the third axis. The top cap wafer, bottom cap wafer and frame structure together form one or more cavities enclosing the magnetic field transducers. The MEMS magnetometer further includes first, second and third electrode assemblies, the first and second electrode assemblies being formed in the top and/or bottom cap wafers. Each electrode assembly is configured to sense an output of a respective magnetic field transducer induced by a respective magnetic field component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.