Compositions for the filling of high aspect ratio vertical interconnect access (VIA) holes
US11289238B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 4, 2019 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Dec 4, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D11/52
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.