Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging
US11289395B2 · kind B2 · utility
0Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2020 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jun 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process includes forming one or more apertures on a component backside, creating a vacuum in a mold chase, and engaging the component backside with a mold compound in the mold chase. The one or more apertures form an aperture structure. The aperture structure may include multiple apertures parallel or orthogonal to each other. The apertures have an aperture width, aperture depth, and aperture pitch. These characteristics may be altered to minimize the likelihood of trapped air remaining after creating the vacuum in the mold chase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.