Junrong Yan
18Patents
2h-index
50Co-inventors
49Inventor score
Filing activity: Dec 5, 2014 → Dec 2, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10681338B1 | Detecting interference in depth images captured using overlapping depth cameras | Electricity | 2 | Active |
| US10483239B2 | Semiconductor device including dual pad wire bond interconnection | Electricity | 2 | Active |
| US10418334B2 | Semiconductor device including corner recess | Electricity | 1 | Active |
| US10075216B2 | Method for avoiding downlink interference between indoor DAS system and small base station | Electricity | 0 | Active |
| US9867102B2 | Method for resisting small base station uplink signal interference of indoor DAS system based on antenna selection | Electricity | 0 | Active |
| US10283485B2 | Semiconductor device including conductive bump interconnections | Electricity | 0 | Active |
| US11756932B2 | Sloped interconnector for stacked die package | Electricity | 0 | Active |
| US11445504B2 | Method for distributing pilot frequency in massive antenna system | Emerging Cross-Sectional Technologies | 0 | Active |
| US11177241B2 | Semiconductor device with top die positioned to reduce die cracking | Electricity | 0 | Active |
| US9462694B2 | Spacer layer for embedding semiconductor die | Emerging Cross-Sectional Technologies | 0 | Active |
| US11783346B2 | Blockchain enabled collaborative transaction information processing for a supply chain | Emerging Cross-Sectional Technologies | 0 | Active |
| US11749647B2 | Semiconductor device including vertical wire bonds | Electricity | 0 | Active |
| US10128218B2 | Semiconductor device including die bond pads at a die edge | Electricity | 0 | Active |
| US11289395B2 | Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging | Electricity | 0 | Active |
| US12083715B2 | Mold compound dispensing system and method | Electricity | 0 | Active |
| US11240486B1 | Detecting interference in depth images captured using overlapping depth cameras | Electricity | 0 | Active |
| US11901327B2 | Wire bonding for semiconductor devices | Electricity | 0 | Active |
| US11894343B2 | Vertical semiconductor device with side grooves | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.