Patent · US Active

Fan-out antenna packaging structure and packaging method

US11289435B2 · kind B2 · utility

0Cited by

1References

16Claims

0Family size

Assignee

SJ Semiconductor (Jiangyin) Corporation · CN

Inventors

Yenheng Chen · Jiangyin, CN
Chengchung Lin · Jiangyin, CN
Chengtar Wu · Jiangyin, CN

Key dates

Filing date	Aug 12, 2020
Grant date	Mar 29, 2022
Priority date	—
Expiry date	Aug 12, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/92244
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure provides a fan-out antenna packaging structure for a semiconductor chip and its fabricating method. The structure is a stacked-up two sets of metal connecting columns and antenna metal patterns arranged in two sequential layers of packaging materials. In some applications there can be more than two sets of the stacked-up antenna structures, fabricated around the chip at one side of a rewiring layer. The chip is interconnected to external metal bumps on the other side of the rewiring layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.