Die bonder incorporating rotatable adhesive dispenser head
US11289445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2018 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Apr 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/75824
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive dispenser for a die bonding apparatus has an adhesive dispenser head configured to dispense adhesive onto bonding pads of a substrate, and a head conveyer configured to convey the adhesive dispenser head along orthogonal first and second axes for dispensing the adhesive onto target dispensing positions on the bonding pads. The head conveyor includes a first linear positioning motor operative to convey the adhesive dispenser head along the first axis and a rotary positioning motor coupled to the first linear positioning motor which is operative to rotate the adhesive dispenser head. The rotary positioning motor is configured to cooperate with the first linear positioning motor to convey the adhesive dispenser head along the second axis to the target dispensing positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.