See Lok Chan
2Patents
1h-index
4Co-inventors
37Inventor score
Filing activity: Dec 12, 2005 → Dec 24, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7726540B2 | Apparatus and method for arranging devices for processing | Emerging Cross-Sectional Technologies | 6 | Active |
| US11289445B2 | Die bonder incorporating rotatable adhesive dispenser head | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.