Wafer and method of manufactruring wafer
US11289576B2 · kind B2 · utility
0Cited by
1References
12Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 23, 2021 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jun 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The wafer having a retardation distribution measured with a light having a wavelength of 520 nm, wherein an average value of the retardation is 38 nm or less, wherein the wafer comprises a micropipe, and wherein a density of the micropipe is 1.5/cm2 or less, is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.