Semiconductor packaging structure having antenna module
US11289793B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2018 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jan 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a semiconductor packaging structure having an antenna module, comprising: a substrate having a first surface and a second surface opposite to the first surface; a redistribution layer located on the first surface of the substrate; a metal bump located on one side, insulated from the substrate, of the redistribution layer, and electrically connected with the redistribution layer; a semiconductor chip disposed on a surface, insulated from the substrate, of the redistribution layer, and electrically connected with the redistribution layer, a space is configured between the semiconductor chip and the metal bump; and an antenna module located on the second surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.