Light source package structure
US11289880B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 7, 2020 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jun 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.