Patent · US Active

Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

US11291115B2 · kind B2 · utility

1Cited by

22References

16Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Shelby Ferguson · Winters, US
Bijoyraj Sahu · Portland, US
Russell S. Aoki · Tacoma, US
Thomas A. Boyd
Eric W. Buddrius · Hillsboro, US
Kevin Ceurter · Olympia, US
Mustafa H. Haswarey · Tigard, US
Rolf Laido · Poway, US
Daniel Neumann · Hillsboro, US
Rachel Taylor · Denver, US
Anthony P. Valpiani · Graham, US

Key dates

Filing date	Mar 30, 2018
Grant date	Mar 29, 2022
Priority date	—
Expiry date	Jun 16, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/2018
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.