Patent · US Active

Dielet design techniques

US11295053B2 · kind B2 · utility

1Cited by
30References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 12, 2019
Grant dateApr 5, 2022
Priority date
Expiry dateSep 12, 2039

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F2115/12
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

Various implementations described herein are directed to an integrated circuit (IC) having a design that is severable into multiple sub-circuits having input-output (IO) ports. The integrated circuit (IC) may include multiple physical electrical connections that are adapted to electrically interconnect the IO ports of the multiple sub-circuits to operate as the IC, and the IO ports have three-dimensional (3D) geometric position information associated therewith.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.