Dielet design techniques
US11295053B2 · kind B2 · utility
1Cited by
30References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2019 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Sep 12, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2115/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Various implementations described herein are directed to an integrated circuit (IC) having a design that is severable into multiple sub-circuits having input-output (IO) ports. The integrated circuit (IC) may include multiple physical electrical connections that are adapted to electrically interconnect the IO ports of the multiple sub-circuits to operate as the IC, and the IO ports have three-dimensional (3D) geometric position information associated therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.