Vertically structured pad system
US11296019B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2020 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Oct 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vertically structured pad system and method can include: a platform having etch attributes, a platform top surface, and a platform side surface; a structure on the platform, the structure including a structure side surface extended up from the platform top surface terminating in a structure top surface, the structure including a structure interior surface defining a cavity within the structure, and the platform top surface exposed from within the cavity; and an interconnect structure adhered to the platform and the structure, the interconnect structure conforming with an exterior shape of the platform side surface in combination with the structure for locking the interconnect structure onto the platform and the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.