Interconnection structure and sensor package
US11296025B2 · kind B2 · utility
0Cited by
0References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2019 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Jul 17, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.