Substrate and semiconductor package comprising an interposer element with a slot and method of manufacturing the same
US11296034B2 · kind B2 · utility
1Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2020 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Jun 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate, a semiconductor package, and a method of manufacturing the same are provided. The substrate includes an interposer element. The interposer element has a first surface and a second surface opposite to the first surface. At least two rows of pads are disposed adjacent to the first surface of the interposer element. The interposer element includes at least one slot disposed between the two rows of pads and extending from the first surface to the second surface, wherein a projection area extending from an edge of the slot to an edge of the first surface of the interpose element is nonoverlapping at least one pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.