Processing oven
US11296049B1 · kind B1 · utility
2Cited by
0References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2021 |
| Grant date | Apr 5, 2022 |
| Priority date | — |
| Expiry date | Aug 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/759
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder reflow oven includes a processing chamber that defines an enclosure. The enclosure includes a spindle configured to support a substrate and rotate the substrate about a central axis of the processing chamber. The spindle is also configured to move vertically along the central axis and position the substrate at different locations within the enclosure. The oven further includes a chemical delivery tube configured to direct a chemical vapor into the enclosure, a lamp assembly configured to heat a top surface of the substrate, and a lift assembly configured to move the spindle along the central axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.