Patent · US Active

Polishing delivery apparatus

US11298798B2 · kind B2 · utility

1Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 14, 2020
Grant dateApr 12, 2022
Priority date
Expiry dateDec 9, 2040

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB24B37/34
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A polishing delivery apparatus, configured to provide slurry and rinse agent to a polishing pad, includes a delivery arm, at least one first nozzle, and at least one second nozzle. The delivery arm is rotatably connected to the polishing pad and has an arc-shaped top surface facing away from the polishing pad, a bottom surface facing away from the arc-shaped top surface, and a recess indenting from the bottom surface. The first nozzle is mounted on the bottom surface of the delivery arm and has a first nozzle head facing toward the polishing pad. The second nozzle is mounted in the recess of the delivery arm and has three second nozzle heads, in which one of the three second nozzle heads faces toward the polishing pad, and the other two of the three second nozzle heads face toward sidewalls of the recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.