Packaging for MEMS transducers
US11299392B2 · kind B2 · utility
1Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | May 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.