Automatic feature extraction from aerial images for test pattern sampling and pattern coverage inspection for lithography
US11301748B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2018 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Mar 22, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to one or more embodiments of the present invention a computer-implemented method for fabricating a chip includes generating, using an aerial image generation system, a set of aerial images for a chip layout, the set of aerial images including an aerial image corresponding to each region from the chip layout. The method further includes automatically determining, using an artificial neural network, a feature vector for each aerial image from the set of aerial images. The method further includes clustering the aerial images using their corresponding feature vectors. The method further includes selecting, as test samples, a predetermined number of aerial images from each cluster. The method further includes performing a pattern coverage inspection of the chip layout using the aerial images that are selected as test samples.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.