Systems and methods for automatic defect recognition
US11301977B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/20084
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An image inspection computing device is provided. The device includes a memory device and at least one processor. The at least one processor is configured to receive at least one sample image of a first component, wherein the at least one sample image of the first component does not include defects, store, in the memory, the at least one sample image, and receive an input image of a second component. The at least one processor is also configured to generate an encoded array based on the input image of the second component, perform a stochastic data sampling process on the encoded array, generate a decoded array, and generate a reconstructed image of the second component, derived from the stochastic data sampling process and the decoded array. The at least one processor is further configured to produce a residual image, and identify defects in the second component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.