System and method for controlling semiconductor manufacturing equipment
US11302545B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Jul 15, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
The present disclosure provides a system and a method for controlling semiconductor manufacturing equipment. The system includes a sensor, a sensor interface, and an analysis unit. The sensor provides a sensor signal. The sensor interface receives the sensor signal and generates an input signal for a database server. A front-end subsystem receives the input signal from the database server and performs a comparison process to generate a data signal. A calculation subsystem performs an artificial intelligence analytical process to generate an optimal parameter set and a simulated result map according to the data signal. A message and tuning subsystem generates an alert signal and a feedback signal according to the optimal parameter set and the simulated result map, and the message and tuning subsystem transmits the alert message to a user of the semiconductor manufacturing equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.