Micro assembler with fine angle control
US11302554B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2018 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Jan 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly surface has an array of electrodes arranged such that each of a plurality of chiplets can be positioned to cover at least one of the electrodes. A field generator applies a rotation field that is orthogonal to the clamping force field applied by the electrodes. A processor is operable to determine a desired orientation angle of a first subset of the chiplets and activate one or more of the electrodes so that a second subset of the chiplets different than the first subset is kept from rotating by a clamping force field applied by the one or more of the electrodes. While the clamping force field is being applied, the processor applies the rotation field at the selected angle to cause the first subset of the chiplets to be oriented at the desired orientation angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.