Electrostatic clamping system and method
US11302557B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 1, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Oct 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic clamping system including a platen, an electrostatic electrode associated with the platen, and a sealing cover having a concave lower surface defining a cavity and having a sealing ring extending about a periphery of the lower surface, the sealing cover movable relative to the platen for being moved onto, and being moved off of, a wafer disposed on the platen, the sealing cover further having an inlet valve for introducing a gas into a space between a cover body of the sealing cover and the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.