Patent · US Active

Fan-out antenna package structure and packaging method

US11302658B2 · kind B2 · utility

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10Claims

0Family size

Assignee

SJ Semiconductor (Jiangyin) Corporation · CN

Inventors

Yenheng Chen · Jiangyin, CN
Chengchung Lin · Jiangyin, CN
Chengtar Wu · Jiangyin, CN

Key dates

Filing date	Sep 11, 2020
Grant date	Apr 12, 2022
Priority date	—
Expiry date	Sep 11, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present disclosure provides a fan-out antenna packaging structure for a semiconductor chip and its fabricating method. The structure is a stacked-up two sets of metal connecting columns and antenna metal patterns arranged in two sequential layers of packaging materials sealing the chip. The two sets of metal interconnecting structures in the two layers of packaging materials may have different thicknesses. In some applications there can be more than two sets of the stacked-up antenna structures, fabricated around the chip at one side of a rewiring layer. The chip is interconnected to external metal bumps on the other side of the rewiring layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.