Single and multi-layer mesh structures for enhanced thermal transport
US11306983B2 · kind B2 · utility
2Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jun 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/427
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
This disclosure describes single and multi-layer woven meshes designed to enable sucking flow condensation and capillary-driven liquid film boiling, respectively, for instance, in use in heat spreaders. The single-layer woven meshes can include a nanostructure coating and a hydrophobic coating, while the multi-layer meshes can include a microcavity coating and optionally a hydrophilic coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.