Method for detecting wafer backside defect
US11307151B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2020 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Aug 12, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present disclosure discloses a method for detecting a wafer backside defect, comprising: Step 1, providing a signal database comprising signal data corresponding to various different defects, the defects comprising convex defects and concave defects, the signal data reflecting 3D information of the corresponding defect; Step 2, performing backside scanning on a tested wafer by using oblique incident light, and collecting corresponding emitted and scattered light data; and Step 3, comparing the collected emitted and scattered light data with the signal data, and fitting a defect 3D distribution map of the backside of the tested wafer. The present disclosure can test the height or depth of a wafer backside defect and form a 3D distribution map of the wafer backside defect, which is beneficial for analyzing the source of the wafer backside defect and processing it in time, reducing the troubleshooting time and improving the product yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.